Difference between revisions of "ESP8266EX"
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'''ESP-DIL development board''' | '''ESP-DIL development board''' | ||
− | [[File:ESP_DIL_45.jpg|x150px|left|ESP- | + | [[File:ESP_DIL_45.jpg|x150px|left|ESP-ADC DIL18 module]] |
− | [[File:ESP_Pinbelegung_640.jpg|x150px||ESP- | + | [[File:ESP_Pinbelegung_640.jpg|x150px||ESP-ADC DIL18 module pinning]] |
− | [[File:5xESP-ADC_500x333.jpg|x150px||ESP- | + | [[File:5xESP-ADC_500x333.jpg|x150px||ESP-ADC DIL18 modules delivered in reels]] |
− | [[Media: | + | [[Media:610000292A_handout.pdf.pdf | ESP-ADC DIL18 Schematic and Pinout]]<br/> |
+ | [[Media:610000292A_handout.pdf.pdf | ESP-ADC DIL18 dimensions]]<br/> | ||
http://youtu.be/-T4tdIQMn6c | http://youtu.be/-T4tdIQMn6c |
Revision as of 20:14, 6 February 2015
ESP8266EX, single Chip WiFi network solution, SoC, 802.11bgn Smart Device
ESP8266 is a highly integrated chip designed for the needs of a new connected world. It offers a complete and self-contained Wi-Fi networking solution, allowing it to either host the application or to offload all Wi-Fi networking functions from another application processor.
ESP8266 has powerful on-board processing and storage capabilities that allow it to be integrated with the sensors and other application specific devices through its GPIOs with minimal development up-front and minimal loading during runtime. Its high degree of on-chip integration allows for minimal external circuitry, and the entire solution, including front-end module, is designed to occupy minimal PCB area.
Features:
- 802.11 b/g/n protocol
- Wi-Fi Direct (P2P), soft-AP
- Integrated TCP/IP protocol stack
- Integrated TR switch, balun, LNA, power amplifier and matching network
- Integrated PLL, regulators, and power management units
- +20.5dBm output power in 802.11b mode
- Supports antenna diversity
- Power down leakage current of < 10uA
- Integrated low power 32-bit MCU
- SDIO 2.0, SPI, UART
- STBC, 1x1 MIMO, 2x1 MIMO
- A-MPDU & A-MSDU aggregation & 0.4μs guard interval
- Wake up and transmit packets in < 22ms
- Standby power consumption of < 1.0mW (DTIM3)
- QFN32 package
In-Circuit GmbH offers:
- Integration of ESP8266EX in your Design
- Review of your Design files
- Antenna matching
- Support your certification process
- Assemble your boards (prototypes and series production)
- distribution of ESP8266EX and also the whole chipset (ESP8266EX+Crystal+Seriel flash)
ESP-DIL development board
ESP-ADC DIL18 Schematic and Pinout
ESP-ADC DIL18 dimensions
http://youtu.be/-T4tdIQMn6c